Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available.
Stay Current with the Latest TechnologiesIn addition to updates to nearly every existing chapter, this edition features five entirely new contributions on...
Silicon-on-insulator (SOI) materials and devicesSupercritical CO2 in semiconductor cleaningLow-κ dielectricsAtomic-layer depositionDamascene copper electroplatingEffects of terrestrial radiation on integrated circuits (ICs)Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication.
While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
To view this DRM protected ebook on your desktop or laptop you will need to have Adobe Digital Editions installed. It is a free software. We also strongly recommend that you sign up for an AdobeID at the Adobe website. For more details please see FAQ 1&2. To view this ebook on an iPhone, iPad or Android mobile device you will need the Adobe Digital Editions app, or BlueFire Reader or Txtr app. These are free, too. For more details see this article.
|Size: ||75.9 MB|
|Publisher: ||CRC Press|
|Date published: || 2007|
|ISBN: ||9781420017663 (DRM-PDF)|
|Read Aloud: ||not allowed|
|This ebook will NOT be sold to customers with a billing address in:|